Cleaning process of semiconductor, display, OLED and other high-tech industries
Substitute for strong acid materials used in PR strip, etching process, etc
BOD, COD, SS etc purification treatment of industrial sewage/wastewater
Disinfection and sterilization of medical equipment, food production facilities
It can be used as a substitute for strong acids such as H2SO4, HF, NH03, and does not generate harmful substances to the environment
It can be used in various fields depending on the concentration and has high efficiency
Use Ozone Water Only and DHF Mix for Semiconductor Fine Pattern Organic and Inorganic Cleaning
Application: Semiconductor, Display, Pre-cleaning in OLED process, Post-cleaning
Generated concentration : 10 ~ 190 ppm
Used flow rate : 20 ~ 140 LPM
Low power high concentration ozone gas generator
Compact size and PLC automatic control
Composed of PFA acid-resistant material in all sections, zero corrosion and foreign substances
Able to provide a rapid service response with an in-house production of core parts
Safety design for power and gas use to block emissions and configure interlock
Additional equipment : Ozone destructor, ozone water purification equipment for after using
Patent application : 6 cases including 10-20948230000, 10-21028110000, etc.
Unit | Detail | Connection | ETC | |
---|---|---|---|---|
Dimensions |
850 x 789 x 1789 mm |
- |
- |
|
Power |
Supply |
208V 50/60Hz 60A 3phases |
4P 60A terminal block |
- |
DI Water |
Flow rate |
30 l/min |
1" PVDF ball V/V union |
|
Pressure |
> 3.0 bar |
|
||
Temperature |
< 24℃ |
|
||
PH |
≤ 7 |
|
||
Cooling Water |
Flow rate |
8 l/min |
3/8”Swagelok |
|
Pressure |
>1.5 bar, <5.0 bar |
|
||
Temperature |
< 23℃ |
|
||
CDA |
Flow rate |
40 l/min |
1/4” Swagelok |
|
Pressure |
4.0~6.0 bar |
|
||
Connection |
1/4” VCR |
|
||
O2 |
Purity |
> 99.9% |
1/4” VCR Male Union |
|
Flow rate |
10~20 l/min |
|
||
Pressure |
4.0~6.5 bar |
|
||
N2 |
Purity |
> 99.9% |
1/4” VCR Male Union |
|
Flow rate |
10~20 cc/min |
|
||
Pressure |
4.0~6.5 bar |
|
||
CO2 |
Purity |
> 99.9% |
1/4” VCR Male Union |
|
Flow rate |
1 l/min |
|
||
Pressure |
4.0~6.5 bar |
|
||
Exhaust |
Pressure |
> 400 Pa |
150A SUS Flange | Manufacture and deliver relative flanges in accordance with standard usage specifications |
O3 DIW Out |
O3 DI Water |
30 l/min |
1" piller S300(Double piping 40A) |
|
O3 Return |
10~25 l/min |
3/4" piller S300(Double piping 40A) |
Models with O3 water recovery(Limpio-S30R) |
|
O3 Drain |
7 l/min |
1/2" piller S300(Double piping 40A) |
||
Drain |
Vat Drain |
- |
1/2" Swagelok |
|
Dike Vat Drain |
- |
15A PVC Ball V/V 1/2" PMAIL |
|
Water Flow Rate | Ozonated Water | N2 | O2 | Co2 | Cooling Water | DI Water |
---|---|---|---|---|---|---|
10 LPM |
130 ppm |
10 sccm |
10 LPM |
0.8 LPM |
17℃ |
23℃ |
20 LPM |
110 ppm |
10 sccm |
10 LPM |
0.8 LPM |
17℃ |
23℃ |
30 LPM |
75 ppm |
10 sccm |
10 LPM |
0.8 LPM |
17℃ |
23℃ |
40 LPM |
50 ppm |
10 sccm |
10 LPM |
0.8 LPM |
17℃ |
23℃ |